Abstract
This part of ISO 9455 specifies test methods of cleanliness of the Soldered Printed Circuit Assemblies before and/or after cleaning. The test is applicable to all fluxes as defined in ISO 9454-1.
General information
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Status: Under developmentStage: Final text received or FDIS registered for formal approval [50.00]
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Edition: 1
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Technical Committee :ISO/TC 44/SC 12ICS :25.160.50
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