Abstract
ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
General information
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Status: WithdrawnPublication date: 2014-08Stage: Withdrawal of International Standard [95.99]
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Edition: 3Number of pages: 16
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Technical Committee :ISO/TC 44/SC 12ICS :25.160.50
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Life cycle
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Previously
WithdrawnISO 9453:2006
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Now
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Revised by
PublishedISO 9453:2020