Reference number
ISO 9453:2014
ISO 9453:2014
Soft solder alloys — Chemical compositions and forms
Edition 3
2014-08
Withdrawn
ISO 9453:2014
59299
Withdrawn (Edition 3, 2014)

Abstract

ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

General information

  •  : Withdrawn
     : 2014-08
    : Withdrawal of International Standard [95.99]
  •  : 3
     : 16
  • ISO/TC 44/SC 12
    25.160.50 
  • RSS updates

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