This standard was last reviewed and confirmed in 2014.
Therefore this version remains current.
Abstract
PreviewISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
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Status: PublishedPublication date: 2002-12
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Edition: 1Number of pages: 21
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- ICS :
- 25.160.50 Brazing and soldering
Buy this standard
en
Format | Language | |
---|---|---|
std 1 124 | ||
std 2 124 | Paper |
- CHF124
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