ISO 9455-17:2002
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ISO 9455-17:2002
32830

Abstract

 Preview

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.

This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.


General information 

  •  :  Published
     : 2002-12
  •  : 1
     : 21
  •  : ISO/TC 44/SC 12 Soldering materials
  •  :
    25.160.50 Brazing and soldering

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std 2 124 Paper
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