Specifies the requirements for chemical composition for the following soft solder alloys: tin-lead, with and without antimony; tin-silver, with and without lead; tin-copper, with and without lead; tin-antimony; tin-lead-bismuth; bismuth-tin; tin-lead-cadmium; tin-indium; lead-silver, with and without tin.
Status: WithdrawnPublication date: 1990-11
Edition: 1Number of pages: 4
Technical Committee: ISO/TC 44/SC 12 Soldering materials
- ICS :
- 25.160.50 Brazing and soldering
ISO 9453:1990Stage: 95.99
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